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Inventor profile of:

Terrence C. Caskey

City:

Phoenix, Arizona

Country:

United States

Published Applications:

1

Last publication date:

2006-05-11

Recent patent applications by Caskey Terrence C.

Terrence C. Caskey from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-05-11

US20060097403A1

No-flow underfill materials for flip chips

InventorID:

4620991 ⎘