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Inventor profile of:

J. Eric Rumps

City:

Boise, Idaho

Country:

United States

Published Applications:

1

Last publication date:

2006-05-18

Recent patent applications by Rumps J. Eric

J. Eric Rumps from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-05-18

US20060104870A1

Wafer-scale microwave digestion apparatus and methods

InventorID:

4626649 ⎘