Heiko Dreher

City:

Winden

Country:

Germany

Published Applications:

Last publication date:

2006-05-25

Top Assignees for applications by Heiko Dreher

The entities that hold a legal rights for patent applications filed by inventor Dreher Heiko:

Heiko Dreher from Winden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Integrated circuit with offset pins

Method for testing a chip with a package and for mounting the package on a board

Integrated circuit with offset pins

InventorID:

4629628 ⎘