Hsinchu
Taiwan
47
2026-04-30
The entities that hold a legal rights for patent applications filed by inventor CHEN Wei-Yu:
Wei-Yu CHEN from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
APPARATUS AND METHOD FOR IMPROVED ELECTRON BEAM INSPECTION WITH A CHARGE TREATMENT ELECTRON SOURCE
#2 | 2025-12-11SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
#3 | 2025-11-20PACKAGE STRUCTURE INCLUDING AN ARRAY OF COPPER PILLARS AND METHODS OF FORMING THE SAME
#4 | 2025-11-13SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
#5 | 2025-10-30Package with Integrated Voltage Regulator and Method Forming the Same
#6 | 2025-10-02THREE-DIMENSIONAL (3D) PACKAGE
#7 | 2025-09-25DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING
#8 | 2024-12-05SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME
#9 | 2024-11-21Semiconductor Package and Method
#10 | 2024-10-31PACKAGE PICK-UP APPARATUS AND METHODS FOR USING THE SAME
#11 | 2024-10-24ELECTRONIC DEVICE AND METHOD OF WIRELESS COMMUNICATION
#12 | 2024-04-25SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
#13 | 2024-02-29PACKAGE STRUCTURE
#14 | 2024-02-15PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME
#15 | 2024-01-18Semiconductor Package and Method
#16 | 2023-11-30DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING
#17 | 2023-11-09PROBE CARD SUBSTRATE, SUBSTRATE STRUCTURE AND METHOD OF FABRICATING THE SAME
#18 | 2023-11-02Semiconductor structure and manufacturing method thereof
#19 | 2023-09-28Semiconductor Package and Method of Forming the Same
#20 | 2023-09-28PACKAGE STRUCTURE INCLUDING AN ARRAY OF COPPER PILLARS AND METHODS OF FORMING THE SAME
#21 | 2023-09-28Semiconductor packages and methods of forming the same
#22 | 2022-11-10Semiconductor packages and method of manufacture
#23 | 2022-09-22Die corner removal for underfill crack suppression in semiconductor die packaging
#24 | 2022-08-04Semiconductor structure and manufacturing method thereof
#25 | 2022-07-07Semiconductor package having molded die and semiconductor die and manufacturing method thereof
#26 | 2022-06-23SEMICONDUCTOR PACKAGE AND METHOD
#27 | 2022-01-20Semiconductor packages and methods of forming the same
#28 | 2021-08-05Semiconductor structure and manufacturing method thereof
#29 | 2021-04-29Semiconductor packages and method of manufacture
#30 | 2020-01-23Connecting techniques for stacked substrates
#31 | 2020-01-23Connection structure for stacked substrates
#32 | 2018-10-11Light-emitting device
#33 | 2018-04-19Connecting techniques for stacked CMOS devices
#34 | 2017-09-07Light-emitting element having a reflective structure with high efficiency
#35 | 2016-11-17Connecting techniques for stacked CMOS devices
#36 | 2016-07-21Light-emitting element having a reflective structure with high efficiency
#37 | 2015-06-11Connecting techniques for stacked CMOS devices
#38 | 2015-06-04Light-emitting device
#39 | 2015-02-05Method and layout of an integrated circuit
#40 | 2014-11-27Light-emitting element having a reflective structure with high efficiency
#41 | 2014-11-13Method and layout of an integrated circuit
#42 | 2014-07-10Method and layout of an integrated circuit
#43 | 2014-03-13Light-emitting device
#44 | 2013-11-07Light-emitting device
#45 | 2013-10-31Light-emitting device
#46 | 2013-10-03Light-emitting device
#47 | 2012-10-11Control method for stereolithography structure used in 3-D printing
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