CHENGDU
China
14
2024-12-26
The entities that hold a legal rights for patent applications filed by inventor CHEN YA PING:
YA PING CHEN from CHENGDU, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
NEXFET NGEN3.2 MV DUAL SHIELD OXIDE DAMAGE SOLUTION
#2 | 2024-10-31MONITOR STRUCTURE FOR PHOTORESIST THICKNESS IN TRENCH
#3 | 2023-08-03VERTICAL TRENCH GATE MOSFET WITH INTEGRATED SCHOTTKY DIODE
#4 | 2023-03-23FIELD PLATE ARRANGEMENT FOR TRENCH GATE FET
#5 | 2022-06-30Trench shield isolation layer
#6 | 2022-03-24Dual shield oxide damage control
#7 | 2022-02-17Semiconductor device including a lateral insulator
#8 | 2020-10-22SEMICONDUCTOR DEVICE HAVING POLYSILICON FIELD PLATE FOR POWER MOSFETS
#9 | 2020-10-01Trench shield isolation layer
#10 | 2020-07-02Vertical trench gate MOSFET with integrated Schottky diode
#11 | 2020-07-02Vertical trench gate MOSFET with deep well region for junction termination
#12 | 2019-09-26Semiconductor device having polysilicon field plate for power MOSFETs
#13 | 2014-09-11Multi-landing contact etching
#14 | 2013-10-03Multi-landing contact etching
463101 ⎘