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Inventor profile of:

John C. Malinowski

City:

Jericho, Vermont

Country:

United States

Published Applications:

Last publication date:

2024-03-07

Top Assignees for applications by John C. Malinowski

The entities that hold a legal rights for patent applications filed by inventor Malinowski John C.:

INTERNATIONAL BUSINESS MACHINES CORPORATION 10 ARMONK, NY United States
GLOBALFOUNDRIES Inc. 2 Grand Cayman, Cayman Islands

Recent patent applications by Malinowski John C.

John C. Malinowski from Jericho, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-03-07

US20240079371A1

Electricity

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

#2 | 2015-04-09

US20150097271A1

Electricity

Self-healing crack stop structure

#3 | 2014-01-02

US20140001599A1

Electricity

Semiconductor structure with thin film resistor and terminal bond pad

#4 | 2013-10-03

US20130256826A1

Electricity

Discontinuous guard ring

#5 | 2012-05-17

US20120120758A1

Electricity

Methods for reading a feature pattern from a packaged die

#6 | 2012-05-17

US20120119333A1

Electricity

Product chips and die with a feature pattern that contains information relating to the product chip

#7 | 2010-06-24

US20100155893A1

Electricity

Method for forming thin film resistor and terminal bond pad simultaneously

#8 | 2010-02-25

US20100044858A1

Electricity

Fabricating product chips and die with a feature pattern that contains information relating to the product chip

#9 | 2006-06-27

US9683027

Dual chip stack method for electro-static discharge protection of integrated circuits

#10 | 2006-05-30

US10026146

Multi-level RF passive device

#11 | 2005-03-03

US20050045591A1

Electricity

Method of polishing C4 molybdenum masks to remove molybdenum peaks

InventorID:

463160 ⎘