Niskayuna, New York
United States
11
2017-09-28
The entities that hold a legal rights for patent applications filed by inventor Smith Scott:
Scott Smith from Niskayuna, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Electrical interconnect for an integrated circuit package and method of making same
#2 | 2016-07-21Electrical interconnect for an integrated circuit package and method of making same
#3 | 2016-06-02Electronic packages and methods of making and using the same
#4 | 2015-06-18Electrical interconnect for an integrated circuit package and method of making same
#5 | 2014-07-03Ultrathin buried die module and method of manufacturing thereof
#6 | 2014-06-12Electrical interconnect for an integrated circuit package and method of making same
#7 | 2014-04-24System of chip package build-up
#8 | 2013-10-03Ultrathin buried die module and method of manufacturing thereof
#9 | 2012-09-06PHOTOVOLTAIC MODULE PACKAGE AND FABRICATION METHOD
#10 | 2012-01-26Method of chip package build-up
#11 | 2011-12-29Electrical interconnect for an integrated circuit package and method of making same
463254 ⎘