Jae-Hak Lee

City:

Daejeon

Country:

South Korea

Published Applications:

Last publication date:

2017-07-20

Top Assignees for applications by Jae-Hak Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Jae-Hak:

Jae-Hak Lee from Daejeon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Flexible substrate having a via-hole with a conductive material and a method for manufacturing the same

Semiconductor chip stack package and manufacturing method thereof

Method of fabricating a TSV for 3D packaging of semiconductor device

InventorID:

463273 ⎘