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Inventor profile of:

Kaushik Kumar

City:

Beacon, New York

Country:

United States

Published Applications:

7

Last publication date:

2007-07-10

Top Assignees for applications by Kaushik Kumar

The entities that hold a legal rights for patent applications filed by inventor Kumar Kaushik:

  • INTERNATIONAL BUSINESS MACHINES CORPORATION 7 ARMONK, NY United States
  • Infineon Technologies AG 5 Munich, Germany

Recent patent applications by Kumar Kaushik

Kaushik Kumar from Beacon, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-07-10
US10318606
-

Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer

#2 | 2006-06-01
US20060113278A1
Electricity

Bilayered metal hardmasks for use in dual damascene etch schemes

#3 | 2006-05-30
US10461090
-

Bilayered metal hardmasks for use in Dual Damascene etch schemes

#4 | 2005-12-13
US10319967
-

Copper recess process with application to selective capping and electroless plating

#5 | 2005-07-21
US20050158985A1
Electricity

Copper recess process with application to selective capping and electroless plating

#6 | 2005-04-14
US20050079706A1
Electricity

Dual damascene structure and method

#7 | 2005-04-14
US20050077628A1
Electricity

Dual damascene structure and method

InventorID:

4633162 ⎘

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