Dresden
Germany
18
2009-04-07
The entities that hold a legal rights for patent applications filed by inventor Brintzinger Axel:
Axel Brintzinger from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Arrangement for the protection of three-dimensional structures on wafers
#2 | 2008-02-26Method for forming three-dimensional structures on a substrate
#3 | 2008-02-19Method for improving the mechanical properties of BOC module arrangements
#4 | 2007-01-30Connection between a semiconductor chip and an external conductor structure and method for producing it
#5 | 2006-10-03Method for protecting the redistribution layer on wafers/chips
#6 | 2006-06-08Method for producing a rewiring printed circuit board
#7 | 2005-12-15Process for producing a chip arrangement provided with a molding compound
#8 | 2005-12-15Arrangement for reducing the electrical crosstalk on a chip
#9 | 2005-11-24Arrangement and process for protecting fuses/anti-fuses
#10 | 2005-09-13Manufacturing of a corrosion protected interconnect on a substrate
#11 | 2005-09-01Process for producing layer structures for signal distribution
#12 | 2005-08-25Method for fabricating metallic interconnects on electronic components
#13 | 2005-08-25Process for producing metallic interconnects and contact surfaces on electronic components
#14 | 2005-07-19Method for the solder-stop structuring of elevations on wafers
#15 | 2005-06-28Fabrication method for an interconnect on a substrate
#16 | 2005-06-16Electronic component with compliant elevations having electrical contact areas and method for producing it
#17 | 2005-04-19Methods and apparatus for providing an antifuse function
#18 | 2005-03-15Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level
4638993 ⎘