Daniel K. Lau

City:

Stonecrest Drive, California

Country:

United States

Published Applications:

Last publication date:

2006-07-27

Top Assignees for applications by Daniel K. Lau

The entities that hold a legal rights for patent applications filed by inventor Lau Daniel K.:

ADVANCED INTERCONNECT TECHNOLOGIES LIMITED 1 Port Louis, Mauritius

Recent patent applications by Lau Daniel K.

Daniel K. Lau from Stonecrest Drive, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-07-27

US20060166397A1

Electricity

Thermal enhanced package for block mold assembly

InventorID:

4673097 ⎘