Wayne Patrick Richling

City:

Ft. Collins, Colorado

Country:

United States

Published Applications:

Last publication date:

2006-08-24

Top Assignees for applications by Wayne Patrick Richling

The entities that hold a legal rights for patent applications filed by inventor Richling Wayne Patrick:

Avago Technologies General IP (Singapore) Pte. Ltd. 1 Singapore, Singapore
Avago Technologies General IP Pte. Ltd 1 Singapore, Singapore

Recent patent applications by Richling Wayne Patrick

Wayne Patrick Richling from Ft. Collins, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-08-24

US20060186539A1

Electricity

Trace design to minimize electromigration damage to solder bumps

#2 | 2006-08-03

US20060170100A1

Electricity

Routing design to minimize electromigration damage to solder bumps

InventorID:

4675899 ⎘