William D. Boyd

City:

Plano, Texas

Country:

United States

Published Applications:

Last publication date:

2006-10-12

Top Assignees for applications by William D. Boyd

The entities that hold a legal rights for patent applications filed by inventor Boyd William D.:

William D. Boyd from Plano, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement

Semiconductor package having integrated metal parts for thermal enhancement

Multi-chip flip package with substrate for inter-die coupling

InventorID:

4714007 ⎘