Hidekazu Manabe

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2006-10-26

Top Assignees for applications by Hidekazu Manabe

The entities that hold a legal rights for patent applications filed by inventor Manabe Hidekazu:

Hidekazu Manabe from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of forming leads of a packaged semiconductor device

Method for removing tiebars after molding of semiconductor chip

Apparatus for removing tiebars after molding of semiconductor chip

Method of forming leads of a semiconductor device

InventorID:

4721059 ⎘