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Inventor profile of:

Bill Buttner

City:

Chicago, Illinois

Country:

United States

Published Applications:

1

Last publication date:

2006-11-16

Recent patent applications by Buttner Bill

Bill Buttner from Chicago, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-11-16

US20060254372A1

Non-contact temperature sensor for a weathering test device

InventorID:

4732634 ⎘