Inventor profile of:

Charlotte Emnet

City:

Stuttgart

Country:

Germany

Published Applications:

13

Last publication date:

2021-10-14

Top Assignees for applications by Charlotte Emnet

The entities that hold a legal rights for patent applications filed by inventor Emnet Charlotte:

Recent patent applications by Emnet Charlotte

Charlotte Emnet from Stuttgart, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-10-14
US20210317582A1
Chemistry; metallurgy

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING

#2 | 2020-06-25
US20200199767A1
Chemistry; metallurgy

Composition for metal electroplating comprising leveling agent

#3 | 2020-06-04
US20200173029A1
Chemistry; metallurgy

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING

#4 | 2013-10-10
US20130264213A1
Chemistry; metallurgy

COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT

#5 | 2013-03-21
US20130068626A1
Chemistry; metallurgy

Composition for metal electroplating comprising leveling agent

#6 | 2013-01-24
US20130020203A1
Chemistry; metallurgy

Composition for metal electroplating comprising leveling agent

#7 | 2012-11-22
US20120292193A1
Chemistry; metallurgy

Composition for metal electroplating comprising leveling agent

#8 | 2012-05-24
US20120128888A1
Chemistry; metallurgy

Composition for metal plating comprising suppressing agent for void free submicron feature filling

#9 | 2012-05-17
US20120118750A1
Chemistry; metallurgy

Composition for metal plating comprising suppressing agent for void free submicron feature filling

#10 | 2012-02-02
US20120027948A1
Chemistry; metallurgy

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING

#11 | 2012-02-02
US20120024711A1
Chemistry; metallurgy

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING

#12 | 2012-01-26
US20120018310A1
Chemistry; metallurgy

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING

#13 | 2011-12-01
US20110290659A1
Chemistry; metallurgy

Composition for metal electroplating comprising leveling agent

InventorID:

47381 ⎘