Munchen
Germany
29
2024-05-09
The entities that hold a legal rights for patent applications filed by inventor Zapf Jörg:
Jörg Zapf from Munchen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Encapsulated MEMS Switching Element, Device and Production Method
#2 | 2023-07-27Rectifier and power supply device
#3 | 2023-03-09Electronic module, method for producing an electronic module, and industrial plant
#4 | 2019-10-03Thermoresistive gas sensor
#5 | 2017-07-06PRECONCENTRATOR FOR ABSORBING/DESORBING AT LEAST ONE COMPONENT OF GAS
#6 | 2015-01-15Circuit carrier having a conducting path and an electric shield
#7 | 2014-03-27INTEGRATED CIRCUIT WITH ELECTRICAL THROUGH-CONTACT AND METHOD FOR PRODUCING ELECTRICAL THROUGH-CONTACT
#8 | 2013-10-10Micromechanical substrate for a diaphragm with a diffusion barrier layer
#9 | 2012-10-04Magnetic resonance local coil
#10 | 2012-07-19Thermoelement including a three-dimensional microstructure, and method for producing a thermoelement
#11 | 2012-07-19THERMO-ELECTRIC ENERGY CONVERTER HAVING A THREE-DIMENSIONAL MICRO-STRUCTURE, METHOD FOR PRODUCING THE ENERGY CONVERTER AND USE OF THE ENERGY CONVERTER
#12 | 2010-09-30Piezoelectric component with outer contacting, having gas-phase deposition, method for manufacturing component and use of component
#13 | 2010-08-19Method for contacting electronic components by means of a substrate plate
#14 | 2009-12-31Piezoceramic multilayer actuator and method for the production thereof
#15 | 2009-12-10Piezo actuator comprising a multilayer encapsulation, and method for the production thereof
#16 | 2009-01-27Electronic unit, circuit design for the same, and production method
#17 | 2007-09-20Device having a contacting structure
#18 | 2007-08-16Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules
#19 | 2007-08-02Electrical component on a substrate and method for production thereof
#20 | 2006-11-30Circuit arrangement placed on a substrate and method for producing the same
#21 | 2006-11-09Method of manufacturing a device having a contacting structure
#22 | 2006-11-09Method of manufacturing self-supporting contacting structures
#23 | 2006-09-28Contacting device, testing method and corresponding production method
#24 | 2006-08-31Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours
#25 | 2005-07-14Chip-size package with an integrated passive component
#26 | 2005-07-14Method for producing an electronic device connected to a printed circuit board
#27 | 2005-02-10Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces
#28 | 2005-02-10Module for an analysis device, applicator as an exchange part of the analysis device and analysis device associated therewith
#29 | 2005-02-08Configuration having an electronic device electrically connected to a printed circuit board
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