John E. Lopata

City:

Naperville, Illinois

Country:

United States

Published Applications:

Last publication date:

2006-12-07

Top Assignees for applications by John E. Lopata

The entities that hold a legal rights for patent applications filed by inventor Lopata John E.:

Molex Incorporated 11 Lisle, IL United States

Recent patent applications by Lopata John E.

John E. Lopata from Naperville, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-12-07

US20060274513A1

Electricity

Power delivery to base of processor

#2 | 2006-08-22

US10383028

Power delivery to base of processor

#3 | 2006-06-13

US10330909

Differential transmission channel link for delivering high frequency signals and power

#4 | 2006-01-31

US10783644

Method of making stitched LGA connector

#5 | 2005-11-24

US20050260872A1

Electricity

Impedance-tuned connector

#6 | 2005-11-10

US20050250387A1

Electricity

Grouped element transmission channel link termination assemblies

#7 | 2005-09-20

US10246829

Impedance-tuned connector

#8 | 2005-08-30

US10254496

Power delivery connector for integrated circuits utilizing integrated capacitors

#9 | 2005-05-05

US20050092513A1

Electricity

Grouped element transmission channel link termination assemblies

#10 | 2005-01-27

US20050020100A1

Electricity

Stitched LGA connector

#11 | 2005-01-11

US10331712

Grouped element transmission channel link termination assemblies

InventorID:

4745164 ⎘