Tetsuya Nakamura

City:

Mie

Country:

Japan

Published Applications:

Last publication date:

2019-03-07

Top Assignees for applications by Tetsuya Nakamura

The entities that hold a legal rights for patent applications filed by inventor Nakamura Tetsuya:

Tetsuya Nakamura from Mie, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Wire with a core, a terminal with barrels crimped to the core and a molded portion covering the barrels and the core

Connector housing containing a wire terminal with a molded portion

Terminal-equipped wire and wire harness with resin coating on terminal fitting

Semiconductor device and manufacturing method thereof

InventorID:

4751245 ⎘