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Inventor profile of:

John Bradford Reitz

City:

Country:

United States

Published Applications:

1

Last publication date:

2006-12-28

Recent patent applications by Reitz John Bradford

John Bradford Reitz from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-12-28

US20060293421A1

Chemistry; metallurgy

Methods for embossing and embossed articles formed thereby

InventorID:

4756959 ⎘