Aaron Bond

City:

Orefield, Pennsylvania

Country:

United States

Published Applications:

Last publication date:

2006-01-17

Top Assignees for applications by Aaron Bond

The entities that hold a legal rights for patent applications filed by inventor Bond Aaron:

T-Networks, Inc. 4 Allentown, PA United States

Recent patent applications by Bond Aaron

Aaron Bond from Orefield, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2006-01-17

US10167915

Grating dispersion compensator and method of manufacture

#2 | 2005-03-01

US10895699

Method of fabricating a monolithic expanded beam mode electroabsorption modulator

#3 | 2005-01-27

US20050018732A1

Electricity

Uncooled and high temperature long reach transmitters, and high power short reach transmitters

#4 | 2005-01-18

US10843743

Grating dispersion compensator and method of manufacture

#5 | 2005-01-18

US10635080

Method of stabilizing electro-absorption modulators (EAM's) performance by maintaining constant absorption with the use of intergrated tap couplers and method of manufacture

InventorID:

4774375 ⎘