Jerome Teysseyre

City:

Grenoble

Country:

France

Published Applications:

Last publication date:

2005-04-26

Top Assignees for applications by Jerome Teysseyre

The entities that hold a legal rights for patent applications filed by inventor Teysseyre Jerome:

Jerome Teysseyre from Grenoble, FR has applied for patents for these inventions. The list has both pending applications and granted patents:

Flat leadframe for a semiconductor package

Process for encapsulating semiconductor components using through-holes in the semiconductor components support substrates

InventorID:

4780919 ⎘