Michael Dietterle

City:

Aalen

Country:

Germany

Published Applications:

Last publication date:

2007-02-20

Top Assignees for applications by Michael Dietterle

The entities that hold a legal rights for patent applications filed by inventor Dietterle Michael:

Michael Dietterle from Aalen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Electrolyte and method for depositing tin-copper alloy layers

Electrolyte and method for depositing tin-silver alloy layers

InventorID:

4783252 ⎘