Round Rock, Texas
United States
6
2006-11-21
The entities that hold a legal rights for patent applications filed by inventor Harper Peter R.:
Peter R. Harper from Round Rock, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Packaged IC using insulated wire
#2 | 2006-03-21Packaged integrated circuit having wire bonds and method therefor
#3 | 2005-07-26Semiconductor device having a bond pad and method therefor
#4 | 2005-05-12Semiconductor device having a bond pad and method therefor
#5 | 2005-02-10Integrated circuit with test pad structure and method of testing
#6 | 2005-01-18Semiconductor device having a bond pad and method therefor
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