Niskayuna, New York
United States
6
2005-07-07
The entities that hold a legal rights for patent applications filed by inventor Tonapi Sandeep:
Sandeep Tonapi from Niskayuna, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Thin bond-line silicone adhesive composition and method for preparing the same
#2 | 2005-06-16Underfill composition and packaged solid state device
#3 | 2005-03-03Solvent-modified resin compositions and methods of use thereof
#4 | 2005-03-03Thin bond-line silicone adhesive composition and method for preparing the same
#5 | 2005-03-03Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications
#6 | 2005-03-03No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
4799643 ⎘