Tomoko Doi

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2005-03-03

Recent patent applications by Doi Tomoko

Tomoko Doi from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-03-03

US20050049366A9

Chemistry; metallurgy

Ultraviolet crosslinking pressure-sensitive adhesive composition, process for producing same, pressure-sensitive adhesive sheet and process for producing same

InventorID:

4800156 ⎘