Carsten Bender

City:

Dresden

Country:

Germany

Published Applications:

Last publication date:

2005-12-29

Top Assignees for applications by Carsten Bender

The entities that hold a legal rights for patent applications filed by inventor Bender Carsten:

Carsten Bender from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Arrangement for increasing the reliability of substrate-based BGA packages

Substrate-based die package with BGA or BGA-like components

Arrangement of a chip package constructed on a substrate and substrate for production of the same

Substrate for producing a soldering connection

Arrangement for improving module reliability

InventorID:

4802271 ⎘