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Inventor profile of:

William Lee Devlin

City:

Greeley, Colorado

Country:

United States

Published Applications:

1

Last publication date:

2005-03-10

Recent patent applications by Devlin William Lee

William Lee Devlin from Greeley, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-03-10

US20050055483A1

System and method for file comperssion

InventorID:

4805105 ⎘