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Inventor profile of:

Susumu Ueda

City:

Kagoshima

Country:

Japan

Published Applications:

2

Last publication date:

2013-10-17

Top Assignees for applications by Susumu Ueda

The entities that hold a legal rights for patent applications filed by inventor Ueda Susumu:

Molex Incorporated 2 Lisle, IL United States
Innovation TS Flex-Technology 1 , Malaysia

Recent patent applications by Ueda Susumu

Susumu Ueda from Kagoshima, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-10-17

US20130269913A1

Mechanical engineering

HEAT PIPE

#2 | 2007-10-25

US20070246248A1

Flexible printed circuit board

InventorID:

481908 ⎘