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Inventor profile of:

Shingo Hishida

City:

Osaka

Country:

Japan

Published Applications:

1

Last publication date:

2005-04-07

Recent patent applications by Hishida Shingo

Shingo Hishida from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-04-07

US20050075412A1

Chemistry; metallurgy

Granular additive for synthetic resin, and method for manufacturing same

InventorID:

4820657 ⎘