🔗 Permalink

Inventor profile of:

Eishi Maeda

City:

Saga

Country:

Japan

Published Applications:

1

Last publication date:

2005-04-21

Recent patent applications by Maeda Eishi

Eishi Maeda from Saga, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-04-21

US20050084717A1

Chemistry; metallurgy

Silicon carbide based porous structure and method for manufacturing thereof

InventorID:

4827959 ⎘