Hsinchu
Taiwan
29
2025-11-27
The entities that hold a legal rights for patent applications filed by inventor LIN Hsing-Lien:
Hsing-Lien LIN from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
MEMORY DEVICE STRUCTURE WITH DATA STORAGE ELEMENT
#2 | 2025-11-20MIM CAPACITOR AND METHOD OF FORMING THE SAME
#3 | 2025-09-18FeRAM WITH LAMINATED FERROELECTRIC FILM AND METHOD FORMING SAME
#4 | 2024-02-22FeRAM with Laminated Ferroelectric Film and Method Forming Same
#5 | 2023-12-28MIM CAPACITOR AND METHOD OF FORMING THE SAME
#6 | 2023-11-30MEMORY DEVICE STRUCTURE WITH DATA STORAGE ELEMENT
#7 | 2023-11-16Semiconductor MEMS structure
#8 | 2023-08-10Method for forming semiconductor structure
#9 | 2022-12-08FeRAM with laminated ferroelectric film and method forming same
#10 | 2022-01-27FeRAM with laminated ferroelectric film and method forming same
#11 | 2021-09-02Memory device structure with protective element
#12 | 2021-02-25Semiconductor MEMS structure
#13 | 2020-12-10Memory device structure
#14 | 2020-11-26Image sensors with organic photodiodes and methods for forming the same
#15 | 2020-08-27Semiconductor device structure with multiple resistance variable layers
#16 | 2019-05-30Method of forming memory device with diffusion barrier and capping layer
#17 | 2019-05-23Semiconductor device structure with multiple resistance variable layers
#18 | 2019-04-25MIM capacitor and method of forming the same
#19 | 2018-10-25Image sensors with organic photodiodes and methods for forming the same
#20 | 2017-07-20MIM capacitor and method of forming the same
#21 | 2017-02-16Method of fabricating an organic photodiode with dual electron blocking layers
#22 | 2016-06-09Metal-insulator-metal structure and method for forming the same
#23 | 2015-08-20Semiconductor device and method of forming the same
#24 | 2015-03-05Organic photo diode with dual electron blocking layers
#25 | 2015-03-05Image sensors with organic photodiodes and methods for forming the same
#26 | 2013-10-17Anti-reflective layer for backside illuminated CMOS image sensors
#27 | 2008-12-25MIM capacitors with improved reliability
#28 | 2008-08-07Method of forming metal-insulator-metal structure
#29 | 2007-10-25Low tunneling current MIM structure and method of manufacturing same
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