Inventor profile of:

Hsing-Lien LIN

City:

Hsinchu

Country:

Taiwan

Published Applications:

29

Last publication date:

2025-11-27

Top Assignees for applications by Hsing-Lien LIN

The entities that hold a legal rights for patent applications filed by inventor LIN Hsing-Lien:

Recent patent applications by LIN Hsing-Lien

Hsing-Lien LIN from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-27
US20250366381A1
Electricity

MEMORY DEVICE STRUCTURE WITH DATA STORAGE ELEMENT

#2 | 2025-11-20
US20250359079A1
Electricity

MIM CAPACITOR AND METHOD OF FORMING THE SAME

#3 | 2025-09-18
US20250294776A1
Electricity

FeRAM WITH LAMINATED FERROELECTRIC FILM AND METHOD FORMING SAME

#4 | 2024-02-22
US20240064998A1
Electricity

FeRAM with Laminated Ferroelectric Film and Method Forming Same

#5 | 2023-12-28
US20230420493A1
Electricity

MIM CAPACITOR AND METHOD OF FORMING THE SAME

#6 | 2023-11-30
US20230389453A1
Electricity

MEMORY DEVICE STRUCTURE WITH DATA STORAGE ELEMENT

#7 | 2023-11-16
US20230365395A1
Performing operations; transporting

Semiconductor MEMS structure

#8 | 2023-08-10
US20230255125A1
Electricity

Method for forming semiconductor structure

#9 | 2022-12-08
US20220392906A1
Electricity

FeRAM with laminated ferroelectric film and method forming same

#10 | 2022-01-27
US20220028874A1
Electricity

FeRAM with laminated ferroelectric film and method forming same

#11 | 2021-09-02
US20210273161A1
Electricity

Memory device structure with protective element

#12 | 2021-02-25
US20210053816A1
Performing operations; transporting

Semiconductor MEMS structure

#13 | 2020-12-10
US20200388756A1
Electricity

Memory device structure

#14 | 2020-11-26
US20200373357A1
Electricity

Image sensors with organic photodiodes and methods for forming the same

#15 | 2020-08-27
US20200274058A1
Electricity

Semiconductor device structure with multiple resistance variable layers

#16 | 2019-05-30
US20190165266A1
Electricity

Method of forming memory device with diffusion barrier and capping layer

#17 | 2019-05-23
US20190157553A1
Electricity

Semiconductor device structure with multiple resistance variable layers

#18 | 2019-04-25
US20190123133A1
Electricity

MIM capacitor and method of forming the same

#19 | 2018-10-25
US20180308901A1
Electricity

Image sensors with organic photodiodes and methods for forming the same

#20 | 2017-07-20
US20170207299A1
Electricity

MIM capacitor and method of forming the same

#21 | 2017-02-16
US20170047517A1
Electricity

Method of fabricating an organic photodiode with dual electron blocking layers

#22 | 2016-06-09
US20160163781A1
Electricity

Metal-insulator-metal structure and method for forming the same

#23 | 2015-08-20
US20150236121A1
Electricity

Semiconductor device and method of forming the same

#24 | 2015-03-05
US20150060775A1
Electricity

Organic photo diode with dual electron blocking layers

#25 | 2015-03-05
US20150060774A1
Electricity

Image sensors with organic photodiodes and methods for forming the same

#26 | 2013-10-17
US20130270663A1
Electricity

Anti-reflective layer for backside illuminated CMOS image sensors

#27 | 2008-12-25
US20080318378A1
Electricity

MIM capacitors with improved reliability

#28 | 2008-08-07
US20080188055A1
Electricity

Method of forming metal-insulator-metal structure

#29 | 2007-10-25
US20070247784A1
Electricity

Low tunneling current MIM structure and method of manufacturing same

InventorID:

483030 ⎘