Jeremiah HEBDING

City:

Poughkeepsie, New York

Country:

United States

Published Applications:

Last publication date:

2013-10-17

Top Assignees for applications by Jeremiah HEBDING

The entities that hold a legal rights for patent applications filed by inventor HEBDING Jeremiah:

The Research Foundation of State University of New York 2 Albany, NY United States

Recent patent applications by HEBDING Jeremiah

Jeremiah HEBDING from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-10-17

US20130273691A1

Performing operations; transporting

Method for thin die-to-wafer bonding

#2 | 2013-10-17

US20130270711A1

Electricity

Apparatus and method for integration of through substrate vias

InventorID:

483087 ⎘