Sudipto Ranendra Roy

City:

Spring Grove

Country:

Singapore

Published Applications:

Last publication date:

2005-04-28

Top Assignees for applications by Sudipto Ranendra Roy

The entities that hold a legal rights for patent applications filed by inventor Roy Sudipto Ranendra:

Chartered Semiconductor Manufacturing, Ltd. 2 Singapore, Singapore

Recent patent applications by Roy Sudipto Ranendra

Sudipto Ranendra Roy from Spring Grove, SG has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-04-28

US20050090102A1

Electricity

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

#2 | 2005-04-28

US20050090039A1

Electricity

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

InventorID:

4832191 ⎘