Fishkill, New York
United States
80
2016-04-07
The entities that hold a legal rights for patent applications filed by inventor Guo Dechao:
Dechao Guo from Fishkill, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Partial sacrificial dummy gate with CMOS device with high-k metal gate
#2 | 2015-08-20Self-Aligned III-V MOSFET Fabrication With In-Situ III-V Epitaxy And In-Situ Metal Epitaxy and Contact Formation
#3 | 2015-08-13Self aligned embedded gate carbon transistors
#4 | 2015-07-09Fabricating shallow-trench isolation semiconductor devices to reduce or eliminate oxygen diffusion
#5 | 2015-07-09Fabricating shallow-trench isolation semiconductor devices to reduce or eliminate oxygen diffusion
#6 | 2015-07-02Partial sacrificial dummy gate with CMOS device with high-k metal gate
#7 | 2015-07-02STACKED CARBON-BASED FETS
#8 | 2015-04-30CONTINUOUSLY SCALABLE WIDTH AND HEIGHT SEMICONDUCTOR FINS
#9 | 2015-04-16Fabricating shallow-trench isolation semiconductor devices to reduce or eliminate oxygen diffusion
#10 | 2015-03-26Faceted intrinsic epitaxial buffer layer for reducing short channel effects while maximizing channel stress levels
#11 | 2015-03-12Semiconductor-on-insulator device including stand-alone well implant to provide junction butting
#12 | 2015-03-12Semiconductor-on-insulator device including stand-alone well implant to provide junction butting
#13 | 2015-03-05Light emitting diode (LED) using carbon materials
#14 | 2014-12-25Strained finFET with an electrically isolated channel
#15 | 2014-11-13Stacked carbon-based FETs
#16 | 2014-11-13Stacked carbon-based FETs
#17 | 2014-10-23Self aligned embedded gate carbon transistors
#18 | 2014-10-23Self aligned embedded gate carbon transistors
#19 | 2014-09-18Method and structure for dielectric isolation in a fin field effect transistor
#20 | 2014-09-18Faceted intrinsic epitaxial buffer layer for reducing short channel effects while maximizing channel stress levels
#21 | 2014-09-18STRESS-ENHANCING SELECTIVE EPITAXIAL DEPOSITION OF EMBEDDED SOURCE AND DRAIN REGIONS
#22 | 2014-09-04Work function adjustment by carbon implant in semiconductor devices including gate structure
#23 | 2014-08-07Partial sacrificial dummy gate with CMOS device with high-k metal gate
#24 | 2014-07-24Extremely Thin Semiconductor-On-Insulator Field-Effect Transistor With An Epitaxial Source And Drain Having A Low External Resistance
#25 | 2014-07-24EXTREMELY THIN SEMICONDUCTOR-ON-INSULATOR FIELD-EFFECT TRANSISTOR WITH AN EPITAXIAL SOURCE AND DRAIN HAVING A LOW EXTERNAL RESISTANCE
#26 | 2014-07-10Strained finFET with an electrically isolated channel
#27 | 2014-06-05Non-volatile graphene nanomechanical switch
#28 | 2014-06-05Non-volatile graphene nanomechanical switch
#29 | 2014-05-15Structure and method to form passive devices in ETSOI process flow
#30 | 2014-05-08Transistors with uniaxial stress channels
#31 | 2014-03-06Partially-blocked well implant to improve diode ideality with SiGe anode
#32 | 2014-03-06Partially-blocked well implant to improve diode ideality with SiGe anode
#33 | 2014-02-13Replacement gate electrode with planar work function material layers
#34 | 2013-12-19Continuously scalable width and height semiconductor fins
#35 | 2013-12-12PREVENTING FULLY SILICIDED FORMATION IN HIGH-K METAL GATE PROCESSING
#36 | 2013-12-12PREVENTING FULLY SILICIDED FORMATION IN HIGH-K METAL GATE PROCESSING
#37 | 2013-11-21Self-aligned III-V MOSFET fabrication with in-situ III-V epitaxy and in-situ metal epitaxy and contact formation
#38 | 2013-11-21Self-aligned III-V MOSFET fabrication with in-situ III-V epitaxy and in-situ metal epitaxy and contact formation
#39 | 2013-10-31FIN FIELD EFFECT TRANSISTOR WITH VARIABLE CHANNEL THICKNESS FOR THRESHOLD VOLTAGE TUNING
#40 | 2013-09-19Self-aligned carbon electronics with embedded gate electrode
#41 | 2013-08-15Transistors with uniaxial stress channels
#42 | 2013-08-08Integration of SMT in replacement gate FINFET process flow
#43 | 2013-07-11finFET with fully silicided gate
#44 | 2013-07-11Scaling of metal gate with aluminum containing metal layer for threshold voltage shift
#45 | 2013-07-11Controlling threshold voltage in carbon based field effect transistors
#46 | 2013-07-11REDUCTION OF CONTACT RESISTANCE AND JUNCTION LEAKAGE
#47 | 2013-07-11FinFET with fully silicided gate
#48 | 2013-07-04III-V compound semiconductor material passivation with crystalline interlayer
#49 | 2013-06-20Embedded stressors for multigate transistor devices
#50 | 2013-06-20Embedded stressors for multigate transistor devices
#51 | 2013-06-20FETs with hybrid channel materials
#52 | 2013-05-23Transistor employing vertically stacked self-aligned carbon nanotubes
#53 | 2013-05-23Transistor employing vertically stacked self-aligned carbon nanotubes
#54 | 2013-05-09Method to fabricate multicrystal solar cell with light trapping surface using nanopore copolymer
#55 | 2013-05-02Threshold Voltage Adjustment For Thin Body Mosfets
#56 | 2013-05-02Threshold voltage adjustment for thin body MOSFETs
#57 | 2013-04-25FinFET structure and method to adjust threshold voltage in a FinFET structure
#58 | 2013-04-18Method to fabricate a vertical transistor having an asymmetric gate with two conductive layers having different work functions
#59 | 2013-04-18Carbon implant for workfunction adjustment in replacement gate transistor
#60 | 2013-04-18Carbon implant for workfunction adjustment in replacement gate transistor
#61 | 2013-04-18Vertical transistor having an asymmetric gate
#62 | 2013-04-16Controlling threshold voltage in carbon based field effect transistors
#63 | 2013-04-11Work function adjustment by carbon implant in semiconductor devices including gate structure
#64 | 2013-04-11Light emitting diode (LED) using carbon materials
#65 | 2013-04-04Structure and method to form passive devices in ETSOI process flow
#66 | 2013-02-28Nanopillar E-fuse structure and process
#67 | 2013-01-31Single Liner Process to Achieve Dual Stress
#68 | 2013-01-24Replacement gate electrode with planar work function material layers
#69 | 2012-12-27Self-aligned carbon electronics with embedded gate electrode
#70 | 2012-12-06REPLACEMENT GATE ELECTRODE WITH A TUNGSTEN DIFFUSION BARRIER LAYER
#71 | 2012-11-22Self-aligned carbon electronics with embedded gate electrode
#72 | 2012-11-15Post-planarization UV curing of stress inducing layers in replacement gate transistor fabrication
#73 | 2012-10-25Resonance nanoelectromechanical systems
#74 | 2012-10-11Nanopillar decoupling capacitor
#75 | 2012-10-04Structure and process for metal fill in replacement metal gate integration
#76 | 2012-09-20Fin field effect transistor with variable channel thickness for threshold voltage tuning
#77 | 2012-08-30Tensile stress enhancement of nitride film for stressed channel field effect transistor fabrication
#78 | 2012-07-26Self-aligned III-V MOSFET fabrication with in-situ III-V epitaxy and in-situ metal epitaxy and contact formation
#79 | 2012-05-31III-V compound semiconductor material passivation with crystalline interlayer
#80 | 2011-12-27Replacement metal gate method
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