Tae-Sik Eo

City:

Gyeonggi-Do

Country:

South Korea

Published Applications:

Last publication date:

2008-01-22

Top Assignees for applications by Tae-Sik Eo

The entities that hold a legal rights for patent applications filed by inventor Eo Tae-Sik:

Tae-Sik Eo from Gyeonggi-Do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for interconnecting multi-layer printed circuit board

Multi-layer printed circuit board and fabricating method thereof

InventorID:

4838217 ⎘