Mario Interrante

City:

New Paltz, New York

Country:

United States

Published Applications:

Last publication date:

2005-05-19

Top Assignees for applications by Mario Interrante

The entities that hold a legal rights for patent applications filed by inventor Interrante Mario:

Mario Interrante from New Paltz, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Structure and method for lead free solder electronic package interconnections

Solder hierarchy for lead free solder joint

Structure and method for lead free solder electronic package interconnections

InventorID:

4843986 ⎘