Singapore
Singapore
6
2013-02-14
The entities that hold a legal rights for patent applications filed by inventor Liao Ebin:
Ebin Liao from Singapore, SG has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of Forming a Bonded Structure
#2 | 2013-01-24Wafer level package and a method of forming a wafer level package
#3 | 2010-07-29ELECTRONIC PACKAGE AND METHOD OF ASSEMBLING THE SAME
#4 | 2010-03-04METHOD FOR STRAINING A SEMICONDUCTOR WAFER AND A WAFER SUBSTRATE UNIT USED THEREIN
#5 | 2009-05-07Method for micro component self-assembly
#6 | 2006-09-07Planar microspring integrated circuit chip interconnection to next level
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