Ryuta Mitsusue

City:

Chiba

Country:

Japan

Published Applications:

Last publication date:

2013-01-24

Top Assignees for applications by Ryuta Mitsusue

The entities that hold a legal rights for patent applications filed by inventor Mitsusue Ryuta:

Ryuta Mitsusue from Chiba, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Wafer level package and a method of forming a wafer level package

Electrostatic vibrator and electronic apparatus

InventorID:

48481 ⎘