Arvind K. SINHA

Ball grid array rework

#2 | 2018-04-05

US20180097330A1

Dynamic keying assembly

#3 | 2018-04-05

US20180097329A1

Dynamic keying assembly

#4 | 2018-03-22

US20180080720A1

Demand-based charging of a heat pipe

#5 | 2018-03-15

US20180073815A1

Demand-based charging of a heat pipe

#6 | 2017-04-13

US20170104284A1

Pin attach converter

#7 | 2017-04-13

US20170102190A1

Demand-based charging of a heat pipe

#8 | 2017-04-13

US20170102189A1

Demand-based charging of a heat pipe

#9 | 2017-04-13

US20170102188A1

Demand-based charging of a heat pipe

#10 | 2017-04-13

US20170102187A1

Demand-based charging of a heat pipe

#11 | 2017-03-30

US20170090129A1

Light pipe connector apparatus

#12 | 2016-12-08

US20160359246A1

Pin attach converter

#13 | 2016-11-01

US14863716

Light pipe connector apparatus

#14 | 2016-07-07

US20160197053A1

Ball grid array rework

#15 | 2016-06-30

US20160187602A1

Dual optical and electrical LGA contact

#16 | 2016-06-30

US20160187601A1

Dual optical and electrical LGA contact

#17 | 2016-06-23

US20160179146A1

Method for containing computer system components

#18 | 2016-06-16

US20160174416A1

Electronic module with laterally-conducting heat distributor layer

#19 | 2016-06-16

US20160172324A1

Alignment of three dimensional integrated circuit components

#20 | 2016-06-16

US20160172252A1

Alignment of three dimensional integrated circuit components

#21 | 2016-05-12

US20160135332A1

Thermal spreading for an externally pluggable electronic module

#22 | 2016-05-12

US20160135327A1

Thermal spreading for an externally pluggable electronic module

#23 | 2016-03-31

US20160095254A1

MANAGING HEAT TRANSFER FOR ELECTRONIC DEVICES

#24 | 2016-03-29

US14698224

Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars

#25 | 2016-03-29

US14598352

Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars

#26 | 2016-01-21

US20160018008A1

Air valve for electronics enclosures

#27 | 2016-01-07

US20160007515A1

Ball grid array rework

#28 | 2016-01-07

US20160007457A1

Ball grid array rework

#29 | 2015-11-05

US20150318231A1

Dual magnetically coupled rotor heat exchanger

#30 | 2015-07-30

US20150214675A1

Dynamic keying assembly

#31 | 2015-07-30

US20150214664A1

Dynamic keying assembly

#32 | 2015-07-09

US20150192219A1

Air valve for electronics enclosures

#33 | 2015-06-04

US20150156923A1

Cooling an electronic device using a thermally conductive loop

#34 | 2015-06-04

US20150156922A1

Continuous loop cooling for an electronic device

#35 | 2015-05-21

US20150138731A1

Cooling apparatus with dynamic load adjustment

#36 | 2015-05-21

US20150136365A1

Cooling apparatus with dynamic load adjustment

#37 | 2015-04-02

US20150092349A1

IMPLEMENTING REDUNDANT AND HIGH EFFICIENCY HYBRID LIQUID AND AIR COOLING FOR CHIPSTACKS

#38 | 2015-03-26

US20150082627A1

Method of affixing a group of elastic filaments to an electronic component body

#39 | 2015-02-19

US20150050823A1

Sealing connector to mitigate corrosion

#40 | 2014-10-23

US20140312750A1

Computer system component bay

#41 | 2014-09-18

US20140268603A1

Area array device connection structures with complimentary warp characteristics

#42 | 2014-07-31

US20140210068A1

Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance

#43 | 2014-06-19

US20140170898A1

Performing operations; transporting

Receptacle with heat management for electronic and optical systems

#44 | 2014-06-19

US20140165378A1

ELECTRONIC COMPONENT RETAINERS

#45 | 2014-03-27

US20140087586A1

SECURING OPPOSING COMPONENTS TO A CIRCUIT BOARD

#46 | 2014-03-27

US20140083741A1

Implementing graphene interconnect for high conductivity applications

#47 | 2014-03-27

US20140083094A1

Implementing microscale thermoacoustic heat and power control for processors and 3D chipstacks

#48 | 2014-03-13

US20140073234A1

CHASSIS WITH AN AIRFLOW ADJUSTMENT

#49 | 2014-03-13

US20140070393A1

Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks

#50 | 2014-01-16

US20140016271A1

Electronic module with laterally-conducting heat distributor layer

#51 | 2013-12-05

US20130321008A1

Heat spreader flatness detection

#52 | 2013-07-11

US20130178092A1

Implementing enhanced dimensional stability with graphite nanotube hybrid socket

#53 | 2013-05-16

US20130122738A1

Plug and receptacle arrangement with connection sensor

#54 | 2013-02-28

US20130055192A1

Motherboard assembly for interconnecting and distributing signals and power

#55 | 2013-02-07

US20130032935A1

Implementing enhanced thermal conductivity in stacked modules

#56 | 2013-01-24

US20130020716A1

System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks

#57 | 2012-11-29

US20120299201A1

Use of a local constraint to enhance attachment of an IC device to a mounting platform

#58 | 2012-08-30

US20120217983A1

Heat spreader flatness detection

#59 | 2012-06-07

US20120138269A1

Duplex flexible heat exchanger

#60 | 2012-04-12

US20120086952A1

Providing thermal compensation for topographic measurement at an elevated temperature using a non-contact vibration transducer

#61 | 2012-03-15

US20120063095A1

Performing operations; transporting

Electronic module with laterally-conducting heat distributor layer

#62 | 2012-01-26

US20120018666A1

Method and system for alignment of graphite nanofibers for enhanced thermal interface material performance

#63 | 2011-12-22

US20110310566A1

Flux-free detachable thermal interface between an integrated circuit device and a heat sink

#64 | 2011-12-15

US20110303403A1

Flexible Heat Exchanger

#65 | 2011-10-06

US20110239790A1

Piezoelectric chromic impact sensor

#66 | 2011-07-28

US20110182575A1

Implementing reduced signal degradation for fiber optic modules

#67 | 2011-04-14

US20110085313A1

Motherboard assembly for interconnecting and distributing signals and power

#68 | 2010-09-30

US20100243716A1

Enhanced Connector Cradle Having a Cooling Shell for Preferential Cooling of Wafers

#69 | 2009-12-24

US20090316376A1

Method and apparatus of changing PCB pad structure to increase solder volume and strength

#70 | 2009-05-14

US20090119911A1

FORMING A THREE-DIMENSIONAL STACKABLE DIE CONFIGURATION FOR AN ELECTRONIC CIRCUIT BOARD

#71 | 2009-05-14

US20090119902A1

Stacked multiple electronic component interconnect structure

#72 | 2009-04-02

US20090083972A1

Electronic assembly and techniques for installing a heatsink in an electronic assembly

#73 | 2009-02-05

US20090034198A1

APPARATUS AND METHOD FOR ATTACHING HEATSINKS

#74 | 2008-12-18

US20080308260A1

Cold plate stability

#75 | 2008-10-30

US20080266799A1

Cold plate stability

#76 | 2008-10-30

US20080265402A1

REWORK PROCESS AND METHOD FOR LEAD-FREE CAPPED MULTI-CORE MODULES WITH ORGANIC SUBSTRATES

#77 | 2008-09-11

US20080220634A1

Apparatus for restricting rotational moment about a longitudinal axis of SMT connectors

#78 | 2008-09-11

US20080220624A1

METHOD AND APPARATUS FOR RESTRICTING ROTATIONAL MOMENT ABOUT A LONGITUDINAL AXIS OF SMT CONNECTORS

#79 | 2008-07-10

US20080163631A1

Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates

#80 | 2008-04-08

US11683512

Method and apparatus for restricting rotational moment about a longitudinal axis of SMT connectors

#81 | 2008-01-31

US20080024991A1

Heatsink apparatus for applying a specified compressive force to an integrated circuit device

#82 | 2008-01-31

US20080024983A1