Daizou Baba

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2005-06-02

Top Assignees for applications by Daizou Baba

The entities that hold a legal rights for patent applications filed by inventor Baba Daizou:

Daizou Baba from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Wiring board sheet and its manufacturing method, multilayer board and its manufacturing method

InventorID:

4853559 ⎘