Brian F. Ruff

City:

Lee's Summit, Missouri

Country:

United States

Published Applications:

Last publication date:

2008-08-26

Top Assignees for applications by Brian F. Ruff

The entities that hold a legal rights for patent applications filed by inventor Ruff Brian F.:

Brian F. Ruff from Lee's Summit, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Electronic equipment module mounting apparatus and method

Apparatus and method for a connector having a data module

Conductor termination apparatus and method

Retractable panel interface cable device and method

Grounding apparatus for an electronic module

Grounding apparatus for an electronic module

InventorID:

4853644 ⎘