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Inventor profile of:

Tim J. Bales

City:

Bracknell

Country:

United Kingdom

Published Applications:

9

Last publication date:

2007-05-22

Top Assignees for applications by Tim J. Bales

The entities that hold a legal rights for patent applications filed by inventor Bales Tim J.:

Micron Technology, Inc. 9 Boise, ID United States

Recent patent applications by Bales Tim J.

Tim J. Bales from Bracknell, GB has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-05-22

US10675965

Semiconductor package assembly and method for electrically isolating modules

#2 | 2005-08-18

US20050178001A1

Semiconductor package assembly and method for electrically isolating modules

#3 | 2005-07-26

US10631342

Semiconductor package assembly and method for electrically isolating modules

#4 | 2005-07-07

US20050145976A1

Semiconductor package assembly and method for electrically isolating modules

#5 | 2005-06-16

US20050130348A1

Semiconductor package assembly and method for electrically isolating modules

#6 | 2005-06-16

US20050130347A1

Semiconductor package assembly and method for electrically isolating modules

#7 | 2005-06-16

US20050130346A1

Semiconductor package assembly and method for electrically isolating modules

#8 | 2005-06-09

US20050121754A1

Semiconductor package assembly and method for electrically isolating modules

#9 | 2005-02-08

US10057205

Semiconductor package assembly and method for electrically isolating modules

InventorID:

4855824 ⎘