Nick Kuo

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2005-06-09

Top Assignees for applications by Nick Kuo

The entities that hold a legal rights for patent applications filed by inventor Kuo Nick:

Nick Kuo from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto

InventorID:

4855851 ⎘