🔗 Permalink

Inventor profile of:

Erich Thallner

City:

Florian

Country:

Austria

Published Applications:

4

Last publication date:

2012-08-30

Recent patent applications by Thallner Erich

Erich Thallner from Florian, AT has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-08-30

US20120216959A1

Combination of a substrate and a wafer

#2 | 2009-12-03

US20090298207A1

Method for bonding wafers

#3 | 2007-07-05

US20070155129A1

Combination of a substrate and a wafer

#4 | 2005-07-07

US20050146169A1

Alignment device

InventorID:

4873044 ⎘