William D. Boyd

City:

Frisco, Texas

Country:

United States

Published Applications:

Last publication date:

2010-01-21

Top Assignees for applications by William D. Boyd

The entities that hold a legal rights for patent applications filed by inventor Boyd William D.:

William D. Boyd from Frisco, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Thermally enhanced single inline package (SIP)

Wafer-level assembly method for chip-size devices having flipped chips

InventorID:

4876497 ⎘