Ken Chen

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2006-03-21

Top Assignees for applications by Ken Chen

The entities that hold a legal rights for patent applications filed by inventor Chen Ken:

Ken Chen from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly

Buildup substrate pad pre-solder bump manufacturing

Enhanced adhesion strength between mold resin and polyimide

Enhanced adhesion strength between mold resin and polyimide

InventorID:

4887863 ⎘