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Inventor profile of:

Ping Jiang

City:

Danbury, Connecticut

Country:

United States

Published Applications:

Last publication date:

2017-03-16

Top Assignees for applications by Ping Jiang

The entities that hold a legal rights for patent applications filed by inventor Jiang Ping:

ADVANCED TECHNOLOGY MATERIALS, INC. 12 Danbury, CT United States
ENTEGRIS, INC. 3 Billerica, MA United States
Entegris, Inc. 1 Danbury, CT United States

Recent patent applications by Jiang Ping

Ping Jiang from Danbury, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-03-16

US20170079146A1

Electricity

METHOD FOR RECYCLING OF OBSOLETE PRINTED CIRCUIT BOARDS

#2 | 2016-12-15

US20160362804A1

Chemistry; metallurgy

WET BASED FORMULATIONS FOR THE SELECTIVE REMOVAL OF NOBLE METALS

#3 | 2016-05-05

US20160122846A1

Chemistry; metallurgy

SUSTAINABLE PROCESS FOR RECLAIMING PRECIOUS METALS AND BASE METALS FROM E-WASTE

#4 | 2016-03-31

US20160095230A1

Electricity

Method for recycling of obsolete printed circuit boards

#5 | 2015-11-12

US20150322545A1

Chemistry; metallurgy

Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

#6 | 2015-11-12

US20150322540A1

Chemistry; metallurgy

Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

#7 | 2015-11-12

US20150321279A1

Performing operations; transporting

APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT

#8 | 2015-02-19

US20150050199A1

Chemistry; metallurgy

REMOVAL OF LEAD FROM SOLID MATERIALS

#9 | 2014-07-10

US20140191019A1

Performing operations; transporting

Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

#10 | 2013-12-19

US20130336857A1

Chemistry; metallurgy

Sustainable process for reclaiming precious metals and base metals from e-waste

#11 | 2013-11-07

US20130295712A1

Electricity

METHODS OF TEXTURING SURFACES FOR CONTROLLED REFLECTION

#12 | 2013-10-24

US20130276284A1

Electricity

Method for recycling of obsolete printed circuit boards

#13 | 2012-01-19

US20120015857A1

Chemistry; metallurgy

Lithographic tool in situ clean formulations

#14 | 2011-11-10

US20110275164A1

Chemistry; metallurgy

Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon

#15 | 2011-02-17

US20110039747A1

Physics

COMPOSITION AND METHOD FOR REMOVING ION-IMPLANTED PHOTORESIST

#16 | 2010-10-14

US20100261632A1

Chemistry; metallurgy

NON-FLUORIDE CONTAINING COMPOSITION FOR THE REMOVAL OF RESIDUE FROM A MICROELECTRONIC DEVICE

#17 | 2010-07-01

US20100163788A1

Chemistry; metallurgy

LIQUID CLEANER FOR THE REMOVAL OF POST-ETCH RESIDUES

#18 | 2010-05-06

US20100112728A1

Electricity

METHODS FOR STRIPPING MATERIAL FOR WAFER RECLAMATION

#19 | 2009-05-07

US20090118153A1

Chemistry; metallurgy

Metals compatible post-etch photoresist remover and/or sacrificial antireflective coating etchant

#20 | 2008-10-23

US20080261847A1

Chemistry; metallurgy

Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon

InventorID:

491326 ⎘