Eric Eubank

City:

Lee's Summit, Missouri

Country:

United States

Published Applications:

Last publication date:

2005-09-22

Recent patent applications by Eubank Eric

Eric Eubank from Lee's Summit, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of creating multi-layered monolithic circuit structure containing integral buried and trimmed components

InventorID:

4915119 ⎘