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Inventor profile of:

Mark Lynch

City:

Dana Point, California

Country:

United States

Published Applications:

2

Last publication date:

2005-11-17

Recent patent applications by Lynch Mark

Mark Lynch from Dana Point, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2005-11-17

US20050253245A1

Package design and method for electrically connecting die to package

#2 | 2005-09-29

US20050212546A1

Method and apparatus for package testing

InventorID:

4917704 ⎘